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STM32MP157C датащи(PDF) 251 Page - STMicroelectronics |
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STM32MP157C датащи(HTML) 251 Page - STMicroelectronics |
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251 / 260 page ![]() DS12505 Rev 5 251/260 STM32MP157C/F Package information 254 Figure 74. LFBGA448 - Recommended footprint D1 - 16.800 - - 0.6614 - E 17.850 18.000 18.150 0.7028 0.7087 0.7146 E1 - 16.800 - - 0.6614 - e - 0.800 - - 0.0315 - F - 0.600 - - 0.0236 - ddd 0.120 0.0047 eee(4) 0.150 0.0059 fff(5) 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Low profile: 1.20 mm < A ≤ 1.70 mm / Fine pitch: e < 1.00 mm pitch. The total profile height (Dim.A) is measured from the seating plane “C” to the top of the component. The maximum total package height is calculated by the RSS method (Root Sum Square). A Max = A1 Typ + A3 Typ + A4 Typ + √(A1² + A3² + A4² tolerance values). 3. The typical ball diameter before mounting is 0.40 mm 4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B. For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. 5. The tolerance of position that controls the location of the balls within the matrix with respect to each other. For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained entirely in the respective zone eee above. The axis of each ball must lie simultaneously in both tolerance zones. Table 124. LFBGA448 - Recommended PCB design rules (0.8 mm pitch, BGA) Dimension Recommended values Pitch 0.8 mm Dpad 0.320 mm Table 123. LFBGA448 - Mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max BGA_WLCSP_FT_V1 Dsm Dpad |
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