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AM652X датащи(PDF) 165 Page - Texas Instruments

номер детали AM652X
подробное описание детали  Processors Silicon Revision 1.0
PDF  277 Pages
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производитель  TI1 [Texas Instruments]
домашняя страница  http://www.ti.com
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AM652X датащи(HTML) 165 Page - Texas Instruments

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DDR_CK[1:0]P
1
DDR_CK[1:0]N
165
AM6548, AM6528, AM6546
AM6526, AM6527
www.ti.com
SPRSP08I – NOVEMBER 2017 – REVISED DECEMBER 2019
Submit Documentation Feedback
Product Folder Links: AM6548 AM6528 AM6546 AM6526 AM6527
Specifications
Copyright © 2017–2019, Texas Instruments Incorporated
For more information, see section Gigabit Ethernet MAC (MCU_CPSW0) in the device TRM.
5.9.5.3
CSI2
NOTE
For more information, see section Camera Adapter Layer (CAL) Subsystem in the device
TRM.
The camera adaptation layer (CAL) is a very flexible subsystem that enables connection to multiple
cameras supporting MIPI CSI-2 over D-PHY serial interface, a LVDS serial interface, and a traditional
parallel interface.
The device includes one instantiation of CAL Subsystem named CALSS0, with a single companion
CAMERARX0 instance.
CSI2 Port is compliant with MIPI CSI-2 protocol with four data lanes.
5.9.5.4
DDRSS
For more details about features and additional description information on the device DDR3L, DDR4, and
LPDDR4 Memory Interfaces, see the corresponding sections within Section 4.3, Signal Descriptions and
Section 6, Detailed Description.
The device has dedicated interfaces to DDR3L, DDR4, and LPDDR4 SDRAM. It supports JEDEC
JESD79-3-1, JESD79-4B, and JESD209-4B standards compliant DDR3L, DDR4, and LPDDR4 SDRAM
devices with the following features:
16-bit or 32-bit data path to external SDRAM memory
Memory device capacity: Up to 32 GB address space available over one chip select
Table 5-41 and Figure 5-34 present switching characteristics for DDRSS.
Table 5-41. Switching Characteristics for DDRSS
NO.
PARAMETER
DDR TYPE
MODE
MIN
MAX UNIT
1
tc(DDR_CKP/D
DR_CKN)
Cycle time, DDR_CKP and DDR_CKN
DDR3L
1.25
3.3
ns
DDR4
1.25
1.6
LPDDR4
DDR PHY PLL:
DDRPHY_PLLCR0[31] = 0
1.5
3.003
Figure 5-34. DDRSS Memory Interface Clock Timing
For more information, see section DDR Subsystem (DDRSS) in the device TRM.



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