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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32MP151D датащи(PDF) 240 Page - STMicroelectronics |
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STM32MP151D датащи(HTML) 240 Page - STMicroelectronics |
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240 / 253 page  Package information STM32MP151A/D 240/253 DS12500 Rev 3 7.3 TFBA361 package information This TFBGA is a 361 ball, 12x12 mm, 0.5/0.65 mm pitch, thin profile fine pitch ball grid array package. Figure 70. TFBGA - Outline 1. Drawing is not to scale. 2. The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized markings, or other feature of package body or integral heat slug. A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. B031_ME_V1 e2 1 2 3 4 5 6 7 8 9 e1 AB AC Y AA W V U T R P N M L K J H G F E D C B A Central ball matrix pitch 0.65 mm Peripheral ball matrix pitch 0.5 mm D2 D1 D F2 F1 F1 F2 1J 1H 1G 1F 1E 1D 1C 1B 1A e2 E2 E1 E B e1 A1 ball pad corner 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 BOTTOM VIEW C A B C M M eee fff b (361 balls) A2 SEATING PLANE C A1 A ddd C A TOP VIEW SIDE VIEW |
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