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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32MP151D датащи(PDF) 233 Page - STMicroelectronics |
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STM32MP151D датащи(HTML) 233 Page - STMicroelectronics |
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233 / 253 page  DS12500 Rev 3 233/253 STM32MP151A/D Package information 248 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 7.1 TFBGA257 package information This TFBGA is a 257 balls, 10x10 mm, 0.5/0.65 mm pitch, low profile fine pitch ball grid array package Figure 64. TFBGA - Outline 1. Drawing is not to scale. B02Y_ME_V1 D E F1 e1 e2 F2 E2 E1 F1 e2 F2 D2 D1 K H D A B C E F G J L M N P R U T V W A B 1H 1D 1A 1B 1C 1E 1F 1G 1J Peripheral ball matrix pitch 0.5 mm Central ball matrix pitch 0.65 mm 1 2 3 4 5 6 7 8 9 10 11 12 15 13 14 16 17 18 19 1 2 3 4 5 6 7 8 9 A1 ball pad corner b (257 balls) eee M C A B fff M C A A1 A2 SEATING PLANE C ddd C BOTTOM VIEW TOP VIEW SIDE VIEW e1 |
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