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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32MP157C датащи(PDF) 251 Page - STMicroelectronics |
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STM32MP157C датащи(HTML) 251 Page - STMicroelectronics |
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251 / 258 page  DS12505 Rev 2 251/258 STM32MP157C Package information 254 Figure 74. LFBGA - 448 balls, 18x18 mm, 0.8 mm pitch, low profile fine pitch ball grid array recommended footprint 1. Dimensions are expressed in millimeters. D 17.900 18.000 18.100 0.7047 0.7087 0.7126 D1 - 16.800 - - 0.6614 - E 17.900 18.000 18.100 0.7047 0.7087 0.7126 E1 - 16.800 - - 0.6614 - e - 0.800 - - 0.0315 - F - 0.600 - - 0.0236 - ddd - 0.120 - - 0.0047 - eee(3) - 0.150 - - 0.0059 - fff(4) - 0.080 - - 0.0031 - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Low profile: 1.20 mm < A ≤ 1.70 mm / Fine pitch: e < 1.00 mm pitch. The total profile height (Dim.A) is measured from the seating plane “C” to the top of the component. The maximum total package height is calculated by the RSS method (Root Sum Square). A Max = A1 Typ + A2 Typ + A4 Typ + √(A1² + A2² + A4² tolerance values). 3. The typical ball diameter before mounting is 0.40 mm 4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B. For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Table 124. LFBGA - 448 balls, recommended PCB design rules (0.8 mm pitch, BGA) Dimension Recommended values Pitch 0.8 mm Dpad 0.400 mm Table 123. LFBGA - 448 balls, 18x18 mm, 0.8 mm pitch, low profile fine pitch ball grid array mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max B032_LFBGA448_FP_V1 Dpad Dsm |
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