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ATPL230A датащи(PDF) 116 Page - ATMEL Corporation |
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ATPL230A датащи(HTML) 116 Page - ATMEL Corporation |
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116 / 122 page ![]() ATPL230A [DATASHEET] Atmel-43053J-ATPL230A-Datasheet_22-Sep-16 116 12. Recommended mounting conditions 12.1 Conditions of Standard Reflow Figure 12-1. LQFP80 package soldering profile Note: H rank: 260ºC Max a: Average ramp-up rate: 1ºC/s to 4ºC/s b: Preheat & Soak: 170ºC to 190ºC, 60s to 180s c: Average ramp-up rate: 1ºC/s to 4ºC/s d: Peak temperature: 260ºC Max, up to 255ºC within 10s d’: Liquidous temperature: Up to 230ºC within 40s or Up to 225ºC within 60s or Up to 220ºC within 80s e: Cooling: Natural cooling or forced cooling Table 12-1. Conditions of Standard Reflow Items Contents Method IR (Infrared Reflow) / Convection Times 2 Floor Life Before unpacking Please use within 2 years after production From unpacking to second reflow Within 8 days In case over period of floor life Baking with 125ºC +/- 3ºC for 24hrs +2hrs/-0hrs is required. Then please use within 8 days (please remember baking is up to 2 times). Floor Life Condition Between 5ºC and 30ºC and also below 70% RH required. (It is preferred lower humidity in the required temp. range). |
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