 |
поискавой системы для электроныых деталей |
|
|
поискавой системы для электроныых деталей |
|
ST25DV64K датащи(PDF) 189 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
ST25DV64K датащи(HTML) 189 Page - STMicroelectronics |
|
|
189 / 220 page  DocID027603 Rev 4 189/220 ST25DV04K ST25DV16K ST25DV64K Package information 219 10.5 WLCSP10 package information Figure 82. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 220. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.265 0.295 0.325 0.0104 0.0116 0.0128 A1 - 0.095 - - 0.0037 - A2 - 0.175 - - 0.0069 - A3 - 0.025 - - 0.0010 - b - 0.185 - - 0.0073 - D - 1.649 1.669 - 0.0649 0.0657 E - 1.483 1.503 - 0.0584 0.0592 e - 0.400 - - 0.0157 - e1 - 0.800 - - 0.0315 - |
|
ссылки URL |
| Вашему бизинису помогли Аллдатащит? [ DONATE ] |
Что такое Аллдатащит | реклама | контакт | Конфиденциальность | Ссылка на техническое описание | обмен ссыками | поиск по производителю All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Russian ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
