производитель | номер детали | датащи | подробное описание детали |
TE Connectivity Ltd |
V23101
|
1Mb / 4P |
Small size permitting high packing density
|
Shanghai Leiditech Elec... |
BZT52C3V3
|
895Kb / 3P |
Small package size suitable for high-density applications
|
BZT52C62
|
895Kb / 3P |
Small package size suitable for high-density applications
|
BZT52C82
|
912Kb / 3P |
Small package size suitable for high-density applications
|
BZT52C56
|
895Kb / 3P |
Small package size suitable for high-density applications
|
BZT52C5V6
|
928Kb / 3P |
Small package size suitable for high-density applications
|
MAKO SEMICONDUCTOR CO.,... |
2SC4272
|
112Kb / 2P |
Small size making it easy to provide high-density,small-sized
|
Advanced Crystal Techno... |
ACT86SMX
|
116Kb / 1P |
ideal for high density packing and automatic placement on circuit boards
21-11-2006 |
World Produts Inc. |
PCMP384
|
324Kb / 26P |
Small dimension for high density packaging
|
List of Unclassifed Man... |
GWX-38
|
53Kb / 1P |
Miniature size for high density applications
|