LED..R..M Datasheet(PDF) - 39-31-0108 - Molex Electronics Ltd.

производитель	номер детали	датащи	подробное описание детали
Molex Electronics Ltd.	39-31-0108	50Kb/2P	Mini-Fit짰 Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 10 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76關m Gold (Au) Selective Plating, with Drain Holes
	39-31-0168	50Kb/2P	Mini-Fit짰 Jr. Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76關m Gold (Au) Selective Plating, with Drain Holes
	39-29-0063	50Kb/2P	4.20mm Pitch Mini-Fit Jr.??Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 6 Circuits, PA Polyamide Nylon 6/6 94V-2, 0.76關m Gold (Au) Selective Plating, without Drain Holes
	39-31-0148	50Kb/2P	4.20mm Pitch Mini-Fit Jr.??Header, Dual Row, Vertical, without Snap-in Plastic Peg PCB Lock, 14 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76關m Gold (Au) Selective Plating, with Drain Holes
	15-80-0209	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0269	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0309	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0409	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-1161	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-1521	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0229	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0329	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-1201	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-1501	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0289	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0509	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-1121	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0249	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-1061	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing
	15-80-0369	40Kb/2P	2.54mm Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38關m Gold, (Au) Selective Plating, Tin (Sn) PC Tail Plating, 3.81mm Inside Shroud to End Circuit Spacing

LED..R..M датащи, PDF

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