| производитель | номер детали | датащи | подробное описание детали |
Molex Electronics Ltd.
|
73251-2209 |
460Kb/6P |
SMA JACK R/A PCB 50OHM SMA-J/RA/PCB |
| 0713086478 |
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50關m (59u") Minimum |
| 0713085438 |
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 38 Circuits, 1.50關m (59u") Minimum |
| 0713086418 |
1Mb/8P |
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 1.50關m (59u") Minimum |
| 0743232012 |
226Kb/4P |
MicroCross??DVI Analog, High Volume Plug Connector Sub-assembly, Vertical0.76關m (30關") Gold (Au), 17 Circuits, Lead Free |
| 0744410017 |
482Kb/9P |
0.80mm (.031") Pitch XFP Host Connector, Z-Axis Pluggable, Right Angle, SMT, 30Circuits, 0.76關m (30關") Gold (Au |
| 0744410007 |
482Kb/9P |
0.80mm (.031") Pitch XFP Host Connector, Z-Axis Pluggable, Right Angle, SMT, 30Circuits, 0.38關m (15關") Gold (Au) |
| 0736590001 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關") |
| 0702460801 |
187Kb/4P |
2.54mm (.100) Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 8Circuits, 0.38關m (15關) Gold (Au) Selective Plating |
| 0736565001 |
403Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0736560000 |
355Kb/6P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0736590002 |
112Kb/3P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 12 Circuits, Gold (Au) 0.76關m (30關 |
| 0714393164 |
304Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0714393564 |
195Kb/3P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0736561000 |
414Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMCPower Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
| 0714390164 |
325Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0714391564 |
314Kb/4P |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual RowVertical Stacking, Tube, 0.76關m (30關") Gold (Au), 64 Circuits |
| 0740950050 |
221Kb/4P |
2.54mm (.100") Pitch SL??Header, Single Row, Vertical, Shrouded, 20 Circuits0.38關m (15關") Gold (Au) Selective Plating over Tin (Sn) Plating |
| 0740298000 |
237Kb/4P |
2.00mm (.079") Pitch VHDM짰 Board-to-Board Backplane Receptacle Power ModuleVertical, 8-Row, 3 Circuits, Gold (Au) Selective 0.76關m (30關") |
| 0736562001 |
409Kb/7P |
2.00mm (.079") Pitch HDM짰 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76關m (30關") |
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