| производитель | номер детали | датащи | подробное описание детали |
Molex Electronics Ltd.
|
1719750121 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 21 Circuits |
| 1719750125 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 25 Circuits |
| 1719750202 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 2 Circuits |
| 1719750204 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 4 Circuits |
| 1719750211 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 11 Circuits |
| 1719750221 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Right-Angle, LCP, Shrouded, Through Hole,with Pegs, 0.75關m Selective Gold (Au) Plating, 21 Circuits |
| 1719730705 |
47Kb/2P |
2.54mm Pitch SL Header, Single Row, Vertical, LCP, Shrouded, Surface Mount,0.38關m Selective Gold (Au) Plating, 5 Circuits, Tape and Reel |
| 0758888000 |
30Kb/2P |
2.00mm Pitch VHDM Board-to-Board Backplane Receptacle Power Module, Vertical, 8- Row, 3 Circuits, Gold (Au) Selective 0.76關m Lead-Free |
| 0002065102 |
30Kb/1P |
1.57mm Diameter, Standard .062 Pin and Socket Crimp Terminal, Female, with 0.76關m Gold (Au) Plated Brass Contact, 18-24 AWG, Bag |
| 0010897380 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 38 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897702 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 70 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897680 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 68 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897080 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 8 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897182 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 18 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897340 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 34 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897600 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 60 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897300 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 30 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
| 0010897402 |
433Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 40 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897202 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 20 Circuits, 0.38關m (15關") Gold (Au) Selective Plating |
| 0010897760 |
432Kb/4P |
2.54mm (.100") Pitch C-Grid짰 Breakaway Header, Dual Row, Vertical, High Temperature, 76 Circuits, 0.76關m (30關") Gold (Au) Selective Plating |
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