| производитель | номер детали | датащи | подробное описание детали |

AVX Corporation
|
08055A561JAT2A |
115Kb/4P |
Packaging of Chip Components |

PHOENIX CONTACT
|
2201759 |
43Kb/2P |
Components of electronic housing |

M/A-COM Technology Solu...
|
M513 |
496Kb/28P |
Tape and Reel Packaging for Surface Mount Components |

Samsung semiconductor
|
CIG22L1R0MNE |
4Mb/31P |
MULTILAYER CHIP COMPONENTS |

M/A-COM Technology Solu...
|
ANI-019 |
588Kb/6P |
Tape & Reel Packaging and Orientation for Surface Mount Components |
| ANI-019 |
288Kb/7P |
Tape & Reel Packaging and Orientation for Surface Mount Components |

Vishay Siliconix
|
84063 |
609Kb/5P |
The Constituents of Semiconductor Components Rev. 7, 07-Jan-03 |

PHOENIX CONTACT
|
2906911 |
54Kb/2P |
Components of electronic housing - ME LPZS |

Amphenol Corporation
|
P-UE86-3G8620-X0X61 |
1,009Kb/5P |
PACKAGING: TRAY PACKAGING |

Aries Electronics, Inc.
|
800 |
723Kb/1P |
DIP Packaging of LEDs, Incandescent Lamps, DIP Switches |

Johanson Technology Inc...
|
L-14C39NJV4T |
191Kb/2P |
Chip and Wirewound Inductor Packaging Information |

Murata Manufacturing Co...
|
LFD21920MDP1A048 |
52Kb/2P |
Microwave Components Chip Multilayer Diplexers |

Fairchild Semiconductor
|
AN-9052 |
40Kb/4P |
Design Guide for Selection of Bootstrap Components |

Vishay Siliconix
|
FCSP05H40ETR |
80Kb/5P |
chip scale packaging to deliver Schottky diodes Revision: 26-Aug-08 |

Pericom Semiconductor C...
|
PI5A4684 |
611Kb/8P |
Chip Scale Packaging, Dual SPDT Analog Switch |

Taoglas antenna solutio...
|
LA.02 |
1Mb/20P |
Components can be mounted on opposite side of |

PHOENIX CONTACT
|
2901107 |
52Kb/2P |
Components of electronic housing - ME MAX 22,5 PLATEKMGY 11/05/2018 |
| 5030253 |
49Kb/2P |
Components of electronic housing - UMK-SE 11,25-2 11/05/2018 |

Vishay Siliconix
|
FCSP0530ETR |
86Kb/5P |
chip scale packaging to deliver Schottky diodes Revision: 26-Aug-08 |

Wolfson Microelectronic...
|
WAN-0164 |
93Kb/5P |
Safe Handling and Packaging of Tray Product to be Returned |