1. General Overview & Product Identification:

️· Product: MASW20000 GaAs SPDT Switch
️· Type: SPDT (Single-Pole Double-Throw) Switch
️· Metallization: Back-metallized with Pd/Ni/Au (100/1,000/30,000Å)

2. Handling Precautions (Critical - Read Carefully!)

️· Static Sensitivity: Die handling equipment and personnel *must* be DC grounded. GaAs devices are extremely sensitive to electrostatic discharge (ESD).
️· Cleanliness: Handle in a clean environment. Do not attempt to clean after installation.
️· Transients: Avoid power/instrument transients while biased. Use shielded cables.
️· Bias Port Control: When applying voltage, ground the *other* control port (either A1/B2 or A2/B1). Do not let either port "float."
️· Physical Handling: Use a sharp pair of bent tweezers. *Do not* touch the surface of the chip with fingers or tweezers.

3. Mounting Instructions:

️· Eutectic Die Attach (Au/Sn Preform):
- Recommended Preform: 80/20 Au/Sn
- Work Surface Temp: ~255°C
- Tool Temp: 265°C
- Gas Environment (if used): Hot 90/10 Nitrogen/Hydrogen, solder temperature ~290°C
- *Crucial Limit:* Do not expose to temperatures above 320°C for more than 20 seconds. Scrubbing time should be limited to 3 seconds.
️· Epoxy Die Attach:
- Use a minimum amount of thermally conductive epoxy.
- Ensure a thin epoxy fillet around the perimeter.
- Follow the epoxy manufacturer's curing schedule.
- Electrically conductive epoxy is *recommended* but not required.

4. Wire Bonding:

️· Materials: Ball or wedge bond with 1.0 mil diameter pure gold wire. Gold ribbon (3.0 mil x 0.5 mil) may also be used.
️· Equipment: Thermo sonic wire bonding.
️· Parameters: Nominal stage temperature of 150°C. Ball bonding force 40-50 grams or wedge bonding force 18-22 grams. Adjust ultrasonic energy and time to achieve reliable bonds.
️· Connection: Wirebonds should be started on the chip and terminated on the package.

5. Truth Table & Operation

A1/B2	A2/B1	RF1	RF2
VIN Hi	VIN Low	On	Off
VIN Low	VIN Hi	Off	On

️· Normal Operation: A1 connected to B2 and A2 connected to B1.

6. Key Temperature and Time Limits:

️· Maximum Exposure Temperature (Eutectic): 320°C (for no more than 20 seconds)
️· Maximum Scrubbing Time (Eutectic): 3 seconds



This summary provides a consolidated overview. *Pay close attention to the handling precautions as damage to the chip can easily occur.*