1. Device Overview

️· Devices Covered: This datasheet covers a range of Zener diodes:
- 1N3016UR-1 through 1N3045UR-1
- CDLL3016B through CDLL3045B
️· Type: Zener Diodes
️· Package: DO-213AB (MELF, LL41) - This indicates a surface mount package type.
️· Lead Finish: Tin / Lead

2. Key Electrical Characteristics (from the table)

️· CDLL3016B:
- Zener Voltage: 6.5V (+5% = 6.8V)
- Operating Current (Iz): 0.31A
- Thermal Resistance (RθJA): 50°C/W
️· CDLL3024B:
- Zener Voltage: 15V
- Operating Current (Iz): 0.17A
- Thermal Resistance (RθJA): 50°C/W
️· CDLL3045B:
- Zener Voltage: 110V (+5% = 115.5V)
- Operating Current (Iz): 0.23 A

3. Key Design Data

️· Polarity: The banded end of the diode should be positive.
️· Thermal Resistance (RθJA): 50 °C/W maximum (junction to ambient)
️· Thermal Impedance (RθJC): 15 °C/W maximum (junction to case)
️· Coefficient of Thermal Expansion (COE): Approximately +6PPM/°C – This is important for choosing a compatible mounting surface.

4. Physical Dimensions (in millimeters and inches)

Dimension	Min (mm)	Max (mm)	Min (inch)	Max (inch)
D	2.39	5.56	0.094	0.217
F	5.56	5.56	0.217	0.217
G	4.80	5.20	0.189	0.205
G1	4.11 (Ref)	4.11 (Ref)	0.159 (Ref)	0.159 (Ref)
S	0.03	0.03	0.001	0.001

5. Important Considerations/Notes

️· Suffix Significance: "A" suffix indicates a +10% variation in Zener voltage. "B" suffix indicates a +5% variation. "C" suffix indicates a +2% variation.
️· Thermal Management: Proper mounting and heat sinking are critical for these devices due to the relatively high thermal resistance.
️· Mounting Surface: Choose a mounting surface with a compatible Coefficient of Thermal Expansion to prevent stress and failure.
️· Power Derating Curve: The Power Derating Curve in Figure 2 demonstrates how maximum power dissipation decreases with increasing junction temperature.