производитель | номер детали | датащи | подробное описание детали |
National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
MC16A
|
53Kb / 1P |
16 Lead Ceramic Small Outline Package NS Package Number MC16A
|
Fujitsu Component Limit... |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics |
SSOP24
|
59Kb / 4P |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
Guangdong Youtai Semico... |
LM75B
|
312Kb / 23P |
plastic thin shrink small outline package; 8 leads;
|
National Semiconductor ... |
TA03A
|
59Kb / 1P |
3 Lead Molded TO-220 NS Package Number
|
MC28B
|
61Kb / 1P |
28 Lead Ceramic Small Outline Package, EPROM NS Package
|
STMicroelectronics |
TSSO20
|
57Kb / 4P |
20-LEAD THIN SHRINK SMALL OUTLINE
|
Fairchild Semiconductor |
MSA20
|
12Kb / 1P |
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide Package Number MSA20
|
Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|